BRIDG Highlights of 2019

(January 2020)

New BRIDG Partnerships

TEL

Tokyo Electron (TEL), a globally recognized leader in semiconductor and flat panel display production equipment, is partnering with BRIDG to develop tool and process technology needed to further enable collaborative approaches for development to commercialization of technologies and applications that accelerate commercialization of emerging technologies.

“TEL is excited to partner with BRIDG as we develop leading-edge tool, process, and integration technology for our customers,” says Tony Tsutsumi, TEL Senior Vice President for Corporate Innovation.

Radiance Technologies

Radiance is an employee-owned prime contractor specializing in developing customer-focused solutions in the areas of cybersecurity, systems engineering, prototyping and integration, and operational and strategic intelligence. Founded in Huntsville, Ala., Radiance leverages small business flexibility and large business innovation to provide world-class technical support, solutions, and products.

Through this new partnership, BRIDG and Radiance will develop strategies to advance critical aspects of national security.

SUSS MicroTec

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry, announced a far-reaching collaboration agreement with BRIDG.

This partnership puts an unprecedented array of SUSS MicroTec equipment and fabrication technologies at the doorstep of its North American customer base, readily accessible for demonstrations and evaluations.

“We are very pleased to be working side by side with a pioneering partner like BRIDG. This collaboration is a further step in our mission to expand as a systems and solutions provider and is part of our Strategy for 2025.” said Franz Richter, CEO of SUSS MicroTec. “Our task is to move closer to our customers, understand their needs, offer solutions and make those solutions accessible, with the continual support of our knowledge and expertise.”

Air Force Research Laboratory

The U.S. Air Force Research Laboratory (AFRL), the primary scientific research and development center for the Air Force, awarded BRIDG a major federal defense contract valued at $7.5 million to develop a secure digital twin for semiconductor (SDTS) capability that will enable end-users to validate the integrity of a chip or assembly of multiple chips.

AFRL plays an integral role in the discovery, development, and integration of cost-effective warfighting technologies for the air, space, and cyberspace force. BRIDG will spearhead AFRL’s SDTS initiatives centered on collecting key data from the design and manufacturing processes to accelerate time to market, improve quality, reduce costs, and establish provenance for semiconductor devices.

This contract is another step in a larger effort that the federal government is beginning to undertake to foster microelectronics innovation and ensure access to state-of-the-art capability.

Department of Defense

The U.S. Department of Defense’s Industrial Base Analysis and Sustainment (IBAS) office  awarded BRIDG its first major federal defense contract valued at up to more than $20 million to provide a new technology for next-generation microelectronic multi-chip systems that will strengthen national security and cyber resiliency for the United States defense industrial base.

The microelectronics that are used in large defense projects are frequently outsourced or made by foreign-owned companies. Securing the microelectronics supply chain is a priority of the Department of Defense and this award is the first step in a larger effort that the federal government is beginning to undertake.

While much of this technology has initial defense applications, it also positions BRIDG to become a leader in 5G, the Internet of Things, and the creation of countless smart sensors.

As featured in the January 2020 edition.

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