SIEMENS: Establishing Digital Twin Solutions

As digital technology transforms and traverses diverse industries, these capabilities facilitate the digitalization of semiconductor manufacturing. At the start of 2018, Siemens partnered with BRIDG to launch a milestone within the industry: the first Semiconductor Digital Enterprise Solution. With an in-kind grant to drive the development of digital twin technologies and generate a global difference, the Siemens partnership with BRIDG also leverages an existing 30-year relationship with the University of Central Florida and further solidifies Siemens’ commitment to the Central Florida region.

“The opportunity for BRIDG to team with Siemens and lead the semiconductor industry in digital mapping of the device’s building blocks associated with manufacturing advanced microelectronics is tremendous,” said Chester Kennedy, the CEO of BRIDG. “Partners resembling Siemens assist us in developing and providing commercialization infrastructure, in conjunction with capabilities for proof of concept, custom development, and pilot production. This program lays the foundation for a semiconductor design by establishing digital duplicates for model-based systems.”

Think of the digital twin as a virtual representation of the physical device. Using the digital twin to predict performance and analyze physical performance characteristics creates actionable insight to optimize performance and enhance manufacturability.

Product simulation with digital twins compresses new product introduction cycles, reveals disparate legacy systems, eliminates future process errors and improves fabrication outputs. The combination of expertise establishes, molds and revolutionizes digital twin technologies for the semiconductor industry by providing Siemens’ product lifecycle management (PLM) software portfolio to enable BRIDG’s research and development activities. The initial deployment includes the Tecnomatix® portfolio for plant simulation, Camstar™ Semiconductor Suite and Calibre™ Design and Manufacturing Solutions from Siemens’ recent acquisition of Mentor Graphics. The digital enterprise solution allows companies to streamline and digitize business processes, seamlessly integrating suppliers into the mix to more easily identify issues, improve manufacturing throughput, increase product quality, and reduce overall costs across the lifecycle of products from ideation to realization and utilization.

BRIDG is in a unique position to advance innovation in the semiconductor industry with its smart manufacturing wafer fabrication facility dedicated to new product launch in the ‘internet of things,’” said Rob Rudder, senior vice president, Siemens PLM Software. “Siemens is proud to partner with BRIDG and provide its digital enterprise solution to help accelerate innovation in the manufacturing development of advanced technologies in smart sensors.”

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